MAX1523EUT rev. a reliability report for MAX1523EUT plastic encapsulated devices february 7, 2003 maxim integrated products 120 san gabriel dr. sunnyvale, ca 94086 written by reviewed by jim pedic ord bryan j. preeshl quality assurance quality assurance reliability lab manager executive director
conclusion the max1523 successfully meets the quality and reliability standards required of all maxim products. in addition, maxim?s continuous reliability monitoring program ensures that all outgoing product will continue to meet maxim?s quality and reliability standards. table of contents i. ........device description v. ........quality assurance information ii. ........manufacturing in formation vi. .......reliability evaluation iii. .......packaging information iv. .......die information ......attachments i. device description a. general the max1523 is a s imple, compact boost controller designed for a wide range of dc - dc conversion topologies, including step - up, sepic , and flyback applications. it is for applications where extremely low cost and smal l size are top priorities. this device is designed specifically to provide a simple application circuit and minimize the size and number of external components, making them ideal for pdas, digital cameras, and other low - cost consumer electronics applications. this device use s a unique fixed on - time, minimum off - time architecture, which provides excellent efficiency over a wide - range of input/output voltage combinations and load currents. the fixed on - time is pin selectable to either 0.5s (50% max duty cycle) or 3s (85% max duty cycle), permitting optimization of external component size and ease of design for a wide range of output voltages. the max1523 operate s from a +2.5v to + 5.5v input voltage range and is capable of generating a wide range of outputs. the device has an internal soft - start and short - circuit protection to prevent excessive switching current during startup and under output fault conditions. t he max1523 reenters soft - start mode during outp ut fault conditions. the max1523 is available in a space - saving 6 - pin sot23 package. b. absolute maximum ratings item rating vc c, fb, shdn , set to gnd - 0.3v to +6v ext to gnd - 0.3v to ( vcc + 0.3v) operating temperature range - 40c to +85c junction t emperature +150c storage temperature ran ge - 65c to +150c lead temperature (s oldering, 10s) +300c continuous power dissipation (ta = +70 c ) 6 - pin sot23 696 mw derates above +70 c 6 - pin sot23 8.7 mw/ c
ii. manufacturing information a. description/function: simple sot23 boost controllers b. process: s8 - standard 8 micron silicon gate cmos c. number of device transistors: 1 302 d. fabrication location: california, usa e. assembly location: malaysia , philippines or thailand f. date of init ial production: january, 2001 iii. packaging information a. package type: 6 - lead sot b. lead frame: copper c. lead finish: solder plate d. die attach: non - conductive epoxy e. bondwire: gold (1.0 mil dia.) f. mold material: epoxy with silica filler g. assembly diagr am: buildsheet # 05 - 23 01 - 00 76 h. flammability rating: class ul94 - v0 i. classification of moisture sensitivity per jedec standard jesd22 - a112: level 1 iv. die information a. dimensions: 41 x 57 mils b. passivation: si 3 n 4 /sio 2 (silicon nitride/ silicon dioxide) c. interconnect: tiw/ alcu/ tiwn d. backside metallization: none e. minimum metal width: .8 microns (as drawn) f. minimum metal s pacing: .8 microns (as drawn) g. bondpad dimensions: 2.7 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw
v. quality assurance information a. quality assurance contacts: jim pedicord (reliability lab mana ger) bryan preeshl ( executive director of qa) kenneth huening (vice president) b. outgoing inspection level: 0.1% for all electrical parameters guaranteed by the datasheet. 0.1% for all visual defects. c. observed outgoing defect rate: < 50 ppm d. sampling plan: mil - std - 105d vi. reliability evaluation a. accelerated life test the results of the 135 c biased (static) life test are shown in table 1 . using these results, the failure rate ( l ) is calculated as follows: l = 1 = 1.83 (chi square value for mttf upper limit) mttf 192 x 4389 x 80 x 2 temperature acceleration factor assuming an activation energy of 0.8ev l = 13.57 x 10 - 9 l = 13.57 f.i.t. (60% confid ence level @ 25 c) this low failure rate represents data collected from maxim?s reliability qualification and monitor programs. maxim also performs weekly burn - in on samples from production to assure reliability of its processes. the reliability requir ed for lots which receive a burn - in qualification is 59 f.i.t. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. maxim performs failure analysis on rejects from lots exceeding this level. the b urn - in schematic (spec.# 06 - 5647 ) shows the static circuit used for this test. maxim also performs 1000 hour life test monitors quarterly for each process. this data is published in the product reliability report ( rr - 1m ) located on the maxim website at http://www.maxim - ic.com . b. moisture resistance tests maxim evaluates pressure pot stress from every assembly process during qualification of each new design. pressure pot testing must pass a 20% ltpd for acceptance. additionally, industry sta ndard 85 c/85%rh or hast tests are performed quarterly per device/package family. c. e.s.d. and latch - up testing the py54 - 1 die type has been found to have all pins able to withstand a transient pulse of 10 00v, per mil - std - 883 method 3015 (reference a ttached esd test circuit). latch - up testing has shown that this device withstands a current of 2 50ma .
table 1 reliability evaluation test results MAX1523EUT test item test condition failure sample number of identifica tion size failures static life test (note 1) ta = 135 c dc parameters 80 0 biased & functionality time = 192 hrs. moisture testing (note 2) pressure pot ta = 121 c dc parameters 77 0 p = 15 psi. & functionality r h= 100% time = 168hrs. 85/85 ta = 85 c dc parameters 77 0 rh = 85% & functionality biased time = 1000hrs. mechanical stress (note 2) temperature - 65 c/150 c dc parameters 77 0 cycle 1000 cycles method 1010 note 1: life test data may represent plastic d.i.p. qualification lots. note 2: generic process/package data
attachment #3 table ii. pin combination to be tested. 1 / 2 / 1/ table ii is restated in n arrative form in 3.4 below. 2/ no connects are not to be tested. 3/ repeat pin combination i for each named power supply and for ground (e.g., where v ps1 is v dd , v cc , v ss , v bb , gnd, +v s, - v s , v ref , etc). 3.4 pin combinations to be tested. a. each pin individually connected to terminal a with respect to the device ground pin(s) connected to terminal b. all pins except the one being tested and the ground pin(s) shall be open. b. each pin individually connected to terminal a with respect to each different set of a combination of all named power supply pins (e.g., v ss1 , or v ss2 or v ss3 or v cc1 , or v cc2 ) connected to terminal b. all pins except the one being tested and the power supply pin or set of pins shall be open. c. each input and each output individually connected to terminal a with respect to a combination of all the other input and output pins connected to terminal b. all pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. terminal a (each pin individually connected to terminal a with the other floating) terminal b (the common combination of all like - named pins connected to terminal b) 1. all pins except v ps1 3/ all v ps1 pins 2. all input and output pins all other input - output pins mil std 883d method 3015.7 notice 8 regulated high voltage supply terminal d dut socket terminal c terminal b terminal a current probe (note 6) r = 1.5k w w c = 100pf short r2 s2 s1 r1 c1
document i.d. 06-5647 revision a maxim title: 883 bi circuit (max 1522/23/24) page 2 of 3 devices: max1522 / 1523 / 1524 max. expected current = 1.5ma drawn by: hak tan notes: once per socket once per board 1 2 3 4 8 7 6 5 +5v 1.5ma 47uf 10 k 390 k 10 k 100 ohms fb set gnd ext vcc n/c shdn/ n/c 120 k 0.1uf 8-nso
|
